DailySand tracks UC Riverside across AI, semiconductor infrastructure, capital markets, and critical minerals supply chains. Below are curated source items and daily digests where UC Riverside appears in today's cross-sector intelligence briefing.
1 item across 1 digest
UC Riverside researchers published findings on ESD protection for chiplet-based 3D microsystems, addressing critical reliability challenges in advanced semiconductor packaging. This research is vital for technologists as chiplet architectures become essential for high-performance computing and AI applications where traditional monolithic designs reach physical limits.
Read original →
DailySand