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Researchers from Université Grenoble Alpes and CNRS identified side-channel attack vulnerabilities in 2.5D and 3D chiplet packaging systems. This security research highlights potential risks for advanced semiconductor architectures that could affect adoption rates and require additional security investments.
AI models are scaling toward trillions of parameters, forcing the industry beyond traditional performance approaches into advanced packaging and 3D fabric integration. This shift requires new semiconductor architecture solutions to handle the computational demands of next-generation AI systems.
DailySand