semiconductor architecture

AI models are scaling toward trillions of parameters, forcing the industry beyond traditional performance approaches into advanced packaging and 3D fabric integration. This shift requires new semiconductor architecture solutions to handle the computational demands of next-generation AI systems.

Modern automotive electronics are shifting from System-on-Chip to System-in-Package architectures using multi-die integration to meet increasing compute demands and functional safety requirements. This transformation enables more scalable semiconductor architectures for next-generation vehicle systems.